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Services and Capabilities - Fast SMT Assembly and Printed Circuit Board Fabrication
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| Component Types Passive Components 1. As Small as 0402 Package 2. As Small as 0201 with Design Review Ball Grid Arrays (BGA) 1. As Small as 15 mil pitch Stencil |
Parts Procurement
Solder Types
Other Capabilities
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| Manufacturer | Model | Process |
| DEK | Horizon 03i | Solderpaste Printer |
| MyData | MY15 | Pick and Place |
| My Data | MY 100 SX-14 | Pick and Place |
| Vitronics-Soltec | XPM2 | Reflow Oven |
| YESTech | B3 | Automated Optical Inspection (AOI) System |
| ACE Production Technologies | KISS-102 | Selective Solder |
| ECD | 9600 | Closed Loop Board Cleaning System |
| CAB | Maestro | Depanelizer |
| Glenbrook Technologies, Inc. | RTX-113 | X-Ray |
| Hakko | FM-202 | Solder Stations |
| Vision Engineering | Martin BL-05 | Rework Station |
| Aqueous Technologies | Trident III | Automated Defluxing System |
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Valor |
Trilogy | Assembly CAM Software |
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For PCB History Info, click Here PCB |
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APRIL |
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